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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Trimethylaluminum: Bonding by Charge and Current Topology

Hans-Georg Stammler1, Sebastian Blomeyer1, Raphael J F Berger2,3

  • 1Lehrstuhl für Anorganische Chemie und Strukturchemie, Centrum für Molekulare Materialien CM2, Fakultät für Chemie, Universität Bielefeld, Universitätsstrasse 25, 33615 Bielefeld (Germany).

Angewandte Chemie (International Ed. in English)
|September 23, 2015
PubMed

Keywords:
X-ray diffractionaluminumchemical bondingelectron densityring currentstopology

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