Micro-lens array design on a flexible light-emitting diode package for indoor lighting.

Area of Science:

• Materials Science
• Optoelectronics
• Flexible Electronics

Background:

• Existing organic LED (OLED) lighting panels have limitations in thickness and flexibility.
• Development of advanced packaging techniques is crucial for next-generation flexible electronic devices.

Purpose of the Study:

• To propose and demonstrate an advanced, ultra-thin, flexible LED (FLED) package.
• To investigate the physical properties, including thickness and flexibility, of the novel FLED package.
• To explore the integration of micro-lens arrays for enhanced lighting effects.

Main Methods:

• Utilized a polyimide substrate as the lead frame packaging material for its thermal stability.
• Fabricated a mockup sample of the FLED package and measured its thickness using a vernier caliper.
• Assessed the flexibility of the FLED package by measuring its bending angle around a disk.
• Designed and manufactured a micro-lens array using silicone molding on the FLED.
• Investigated lighting effects by applying different micro-lens types to various lighting regions.

Main Results:

• The developed FLED package achieved a thickness of 260 μm, which is 35% thinner than comparable OLED panels.
• The ultra-thin FLED package demonstrated significant flexibility, with a bending angle of 200.54° around a 1 cm radius disk.
• The integration of micro-lens arrays showed potential for optimizing light distribution in different regions.

Conclusions:

• The proposed polyimide-based FLED packaging technique offers a viable solution for creating ultra-thin and highly flexible LED devices.
• The developed FLED package exhibits superior thinness and flexibility, surpassing current commercial offerings.
• The incorporation of micro-lens arrays presents a promising approach for tailoring the optical performance of FLEDs.