Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars

Vast experiments have demonstrated that the external specimen size makes a large difference in the deformation behavior of crystalline materials. However, as one important kind of internal planar defects, the role of grain boundary (GB) in small scales needs to be clarified in light of the scarce and inconsistent experimental results at present. Through compression of Cu bicrystal and its counterpart monocrystal micropillars, it is found that, in contrast to the monocrystals, the bicrystals are characterized by work hardening with discrete strain bursts. Interestingly, the stress rise between two adjacent strain bursts of the bicrystals increases with the decrease of specimen size. The results suggest that GBs play a critical role in the work hardening of materials in small scales, which may provide important implications to further understand the general work hardening behaviors of materials in the future.