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Updated: Mar 31, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
Krisna C Bhargava1, Bryant Thompson2, Danish Iqbal1
1Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA 90089.
This study presents a workflow for designing microfluidic devices using additive manufacturing, ensuring predictable performance despite manufacturing variations. This approach enables precise, programmable microfluidic circuits for various applications.
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