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The impact of Cr adhesion layer on CNFET electrical characteristics
Wei Liu1, Kiran Chikkadi, Matthias Muoth
1Micro and Nanosystems, Department of Mechanical and Process Engineering, ETH Zurich, 8092 Zurich, Switzerland.
Abstract:
The effect of a Cr adhesion layer on the transfer characteristics of Cr/Au-contacted carbon nanotube field-effect transistors (CNFETs) based on individual single-walled carbon nanotubes (SWNTs) is presented in this paper. We show that a very thin Cr layer (≈0.4 nm) already has an impact on the carrier transport in Schottky-barrier-modulated CNFETs. The ratio of the p- and n-branch current is reduced by eight times when the Cr adhesion layer thickness is increased from 0 to 8 nm. We suggest a change in Schottky barrier height at the contact as the determining mechanism for this result. Additionally, superior lifetime of devices is observed even for non-passivated CNFETs with preserved clean SWNT/Cr/Au-contacts using Cr layer thinner than 2 nm. Our experiments show that the role of the adhesion layer in metal/nanotube contacts should be explicitly considered when designing CNTFET-based circuits, developing CNFET fabrication processes, and analyzing the corresponding properties of the electrical contacts.
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