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A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
Field-effect transistors based on wafer-scale, highly uniform few-layer p-type WSe2
Philip M Campbell1, Alexey Tarasov2, Corey A Joiner2
1School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA and Georgia Tech Research Institute, Georgia Institute of Technology, Atlanta, Georgia 30332, USA. philip.campbell@gatech.edu.
Synthesizing few-layer tungsten diselenide (WSe2) via direct selenization yields wafer-scale, uniform films. This breakthrough enables uniform electrical properties, paving the way for manufacturable semiconductor devices.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Few-layer tungsten diselenide (WSe2) synthesis often yields non-uniform thickness due to domain growth.
- This limits its application in scalable semiconductor technologies.
Purpose of the Study:
- To develop a method for synthesizing wafer-scale, thickness-uniform few-layer p-type WSe2.
- To demonstrate the electrical uniformity of the synthesized WSe2 films.
Main Methods:
- Direct selenization of e-beam evaporated tungsten (W) thin films on SiO2 substrates.
- Wafer-scale Raman mapping to assess thickness uniformity.
- Fabrication and characterization of field-effect transistors (FETs) to evaluate electrical performance.
Main Results:
- Achieved wafer-scale few-layer p-type WSe2 with excellent thickness uniformity across several square centimeters.
- Demonstrated uniform electrical performance in FETs fabricated from the WSe2 films.
- Measured an intrinsic field-effect mobility of 10 cm(2) V(-1) s(-1) at a carrier concentration of 3 × 10(12) cm(-2).
Conclusions:
- Direct selenization offers a scalable route to uniform few-layer WSe2.
- The synthesized WSe2 is suitable for manufacturable semiconductor devices compatible with existing fabrication processes.
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