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Updated: Mar 27, 2026

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
Field-effect transistors based on wafer-scale, highly uniform few-layer p-type WSe2
Philip M Campbell1, Alexey Tarasov2, Corey A Joiner2
1School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA and Georgia Tech Research Institute, Georgia Institute of Technology, Atlanta, Georgia 30332, USA. philip.campbell@gatech.edu.
Abstract:
The synthesis of few-layer tungsten diselenide (WSe2) via chemical vapor deposition typically results in highly non-uniform thickness due to nucleation initiated growth of triangular domains. In this work, few-layer p-type WSe2 with wafer-scale thickness and electrical uniformity is synthesized through direct selenization of thin films of e-beam evaporated W on SiO2 substrates. Raman maps over a large area of the substrate show small variations in the main peak position, indicating excellent thickness uniformity across several square centimeters. Additionally, field-effect transistors fabricated from the wafer-scale WSe2 films demonstrate uniform electrical performance across the substrate. The intrinsic field-effect mobility of the films at a carrier concentration of 3 × 10(12) cm(-2) is 10 cm(2) V(-1) s(-1). The unprecedented uniformity of the WSe2 on wafer-scale substrates provides a substantial step towards producing manufacturable materials that are compatible with conventional semiconductor fabrication processes.
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