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Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Monolithic 3D CMOS Using Layered Semiconductors
Angada B Sachid1,2, Mahmut Tosun1,2,3, Sujay B Desai1,2,3
1Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.
Abstract:
Monolithic 3D integrated circuits using transition metal dichalcogenide materials and low-temperature processing are reported. A variety of digital and analog circuits are implemented on two sequentially integrated layers of devices. Inverter circuit operation at an ultralow supply voltage of 150 mV is achieved, paving the way to high-density, ultralow-voltage, and ultralow-power applications.
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