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Mechanical Properties of Solution-Processed Small-Molecule Semiconductor Films.

Daniel Rodriquez1, Suchol Savagatrup1, Eduardo Valle1

  • 1Department of NanoEngineering, University of California-San Diego , 9500 Gilman Drive, Mail Code 0448, La Jolla, California 92093-0448, United States.

ACS Applied Materials & Interfaces
|April 20, 2016
PubMed
Summary

Semiconducting small molecules can achieve mechanical robustness comparable to polymers, with high stretchability demonstrated in pure films. Processing additives can partially restore deformability lost upon blending with acceptors like PC71BM.

Keywords:
additivesmechanical propertiesorganic semiconductorsorganic solar cellssmall moleculesstretchable electronics

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Area of Science:

  • Materials Science
  • Organic Electronics
  • Polymer Science

Background:

  • Semiconducting small molecules offer advantages over polymers, including synthetic simplicity and purification ease.
  • A key challenge for small-molecule organic semiconductors is their perceived lower mechanical robustness compared to polymers.

Purpose of the Study:

  • To quantitatively measure the mechanical properties (tensile modulus and crack-onset strain) of various small-molecule organic semiconductor films.
  • To compare the mechanical robustness of small-molecule films with conjugated polymers.
  • To investigate the influence of blending with acceptors and processing additives on mechanical properties.

Main Methods:

  • Tensile testing was performed on pure films of small-molecule donors (DTS(FBTTh2)2, SMDPPEH, TIPS-pentacene) and an acceptor (HPI-BT).
  • Mechanical properties were also evaluated for blends of these small molecules with PC71BM and HPI-BT.
  • The impact of processing additives like 1,8-diiodooctane (DIO) and polystyrene (PS) on bulk heterojunction films was assessed.

Main Results:

  • Highly deformable films exhibited tensile moduli and crack-onset strains comparable to conjugated polymers.
  • Pure DTS(FBTTh2)2 films showed a tensile modulus of 0.68 GPa and could be stretched to 14% strain without cracking.
  • Blending with PC71BM significantly reduced stretchability (4.2 GPa, 1.42% strain), but processing additives partially restored it.
  • Tensile modulus and crack-onset strain were strongly correlated, typical for van der Waals solids.
  • Increased surface roughness correlated with higher modulus and brittleness.
  • Alkyl side chains in soluble molecular semiconductors decrease stiffness by reducing intermolecular van der Waals attraction.

Conclusions:

  • Solution-processed semiconducting small molecules can achieve mechanical properties suitable for flexible and stretchable electronics.
  • Understanding structure-property relationships, including surface roughness and intermolecular forces, is crucial for optimizing mechanical robustness.
  • These findings have implications for the stability and application of organic electronic devices, particularly in demanding environments.