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Disturbance characteristics of half-selected cells in a cross-point resistive switching memory array.
Zhe Chen1, Haitong Li, Hong-Yu Chen
1Institute of Microelectronics, Peking University, Beijing 100871, People's Republic of China.
This study analyzes disturbance in cross-point resistive random access memory (RRAM) arrays. A new model and methodology assess cell endurance and reliability, proposing solutions to mitigate disturbance issues.
Area of Science:
- Solid-state device physics
- Non-volatile memory technologies
- Semiconductor device characterization
Background:
- Cross-point resistive random access memory (RRAM) arrays are crucial for high-density non-volatile memory.
- Understanding disturbance characteristics is vital for reliable RRAM operation.
- Existing models may not fully capture the complex behavior of half-selected cells.
Purpose of the Study:
- To comprehensively study disturbance characteristics in cross-point RRAM arrays.
- To develop an analytical model for predicting cell endurance under voltage stress.
- To propose an evaluation methodology for assessing half-selected cell disturb behavior.
Main Methods:
- Development of an analytical model to quantify cell pulse endurance (#Pulse) before disturbance.
- Proposal of an evaluation methodology combining the analytical model and SPICE simulations.
- Assessment of energy consumption, reliable operating cycles, and total error bits.
Main Results:
- Quantification of disturbance in cross-point RRAM arrays under various stress conditions.
- Demonstration of the effectiveness of the proposed methodology in evaluating half-selected cell behavior.
- Evaluation of key performance metrics including energy consumption and error rates.
Conclusions:
- The developed analytical model and evaluation methodology provide a robust framework for understanding RRAM disturbance.
- Insights gained can guide the design of more reliable and energy-efficient RRAM arrays.
- A potential solution for mitigating disturbance in RRAM is identified and proposed.
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