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Corrosion of Reinforcement01:27

Corrosion of Reinforcement

The corrosion of steel reinforcement within concrete is a process influenced by the material's inherent properties and external factors. The high pH level of around 13, provided by calcium hydroxide present in concrete, initially protects the steel reinforcement by promoting the formation of a passive iron oxide layer on its surface.
However, over time and under certain conditions like carbonation, chloride ingress, and cracking this protective state can be compromised. Steel has areas with...
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Microbial Corrosion01:24

Microbial Corrosion

Microbiologically Influenced Corrosion (MIC) is a significant form of material degradation caused by the metabolic activities of microorganisms. This phenomenon poses substantial challenges across various industries, including oil and gas, maritime, and water treatment sectors.MIC occurs when microorganisms, such as bacteria, archaea, and fungi, colonize metal surfaces, forming biofilms that alter the local electrochemical environment. These biofilms can lead to the production of corrosive...
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Corrosion02:49

Corrosion

The degradation of metals due to natural electrochemical processes is known as corrosion. Rust formation on iron, tarnishing of silver, and the blue-green patina that develops on copper are examples of corrosion. Corrosion involves the oxidation of metals. Sometimes it is protective, such as the oxidation of copper or aluminum, wherein a protective layer of metal oxide or its derivatives forms on the surface, protecting the underlying metal from further oxidation. In other cases, corrosion is...
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Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
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Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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Anchoring Junctions01:03

Anchoring Junctions

Anchoring junctions are multiprotein complexes that help cells connect to other cells and the extracellular matrix. Anchoring junctions are present on the lateral and basal surfaces of cells, providing strong and flexible connections. Focal adhesions are often formed due to cell interactions with the ECM substrata, which initiate signal transduction via kinase cascades and other mechanisms. Together, they provide stability and tissue integrity. There are three types of anchoring junctions:...
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