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Related Experiment Video

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Wafer-Scale Microwire Transistor Array Fabricated via Evaporative Assembly.

Jae Hoon Park, Qijun Sun1, Yongsuk Choi

  • 1Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, National Center for Nanoscience and Nanotechnology (NCNST) , Beijing 100083, P. R. China.

ACS Applied Materials & Interfaces
|May 27, 2016
PubMed
Summary

Researchers developed wafer-scale field-effect transistor (FET) arrays using aligned indium-gallium-zinc-oxide (IGZO) semiconductor microwires. This evaporative assembly technique enables precise control over device dimensions for flexible electronics.

Keywords:
blade−coatingmetal oxide semiconductormicrowire transistorplasma−induced metallization

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electronics Engineering

Background:

  • One-dimensional (1D) nano/microwires are crucial for electronic and optical devices.
  • Integrating these into functional networks with controlled alignment and density is challenging.

Purpose of the Study:

  • To demonstrate wafer-scale fabrication of field-effect transistor (FET) arrays using aligned microwires.
  • To develop a facile and reliable method for creating flexible large-area electronics.

Main Methods:

  • Fabrication of wafer-scale microwire FET arrays using aligned indium-gallium-zinc-oxide (IGZO) semiconductor and organic polymeric insulator microwires.
  • Utilizing a large-area evaporative assembly technique for precise manipulation of channel dimensions.
  • Employing solution-processed methods and ion gel gate dielectrics for low-voltage operation on plastic substrates.

Main Results:

  • Achieved maximum electron mobility of 1.02 cm(2) V(-1) s(-1) and an on/off current ratio of 1 × 10(6) in IGZO microwire FETs.
  • Demonstrated fine control over threshold voltages by selecting appropriate polymeric microwires for channel length definition.
  • Successfully fabricated high-performance depletion-load inverters and low-voltage-operated microwire FETs on flexible plastic substrates.

Conclusions:

  • Evaporative assembly is a facile, effective, and reliable technique for fabricating flexible large-area electronics.
  • The developed microwire FET arrays offer precise control over device characteristics and enable high-performance integrated circuits.
  • This approach paves the way for advanced applications in flexible electronics and optoelectronics.