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Optimized SESAMs for kilowatt-level ultrafast lasers
Optics Express
|July 14, 2016
Summary
New semiconductor saturable absorber mirrors (SESAMs) offer superior thermal management for high-power lasers. A novel bonding technique minimizes deformation and improves heat removal without affecting optical performance.
Area of Science:
- Optics and Photonics
- Materials Science
- Laser Technology
Background:
- High-power laser oscillators require robust optical components capable of handling significant thermal loads.
- Semiconductor Saturable Absorber Mirrors (SESAMs) are crucial for ultrafast laser operation but can suffer from thermal effects like deformation and lensing.
- Existing SESAM designs face limitations in managing heat at kilowatt average power levels.
Purpose of the Study:
- To investigate and compare the thermal deformation and properties of SESAMs under high-power laser operation.
- To evaluate the impact of different contacting techniques on SESAM thermal performance.
- To develop and demonstrate an improved SESAM design for kilowatt-level laser oscillators.
Main Methods:
- Comparative analysis of standard and substrate-removed SESAMs.
- Measurement of temperature rise, thermal lensing, and surface deformation under varying absorbed power.
- Utilizing a novel substrate-transfer direct bonding technique for advanced SESAM fabrication.
Main Results:
- Thermal effects in SESAMs scale linearly with absorbed power, with the contacting technique significantly influencing thermal rise and lensing.
- The novel substrate-transfer direct bonding technique yields SESAMs with negligible surface deformation and improved heat removal.
- Optimized SESAMs exhibit non-measurable radii of curvature, a significant improvement over standard designs with astigmatic ROCs up to 10 m.
- Key saturation and recovery parameters of the SESAMs remain unaffected by the new fabrication method.
Conclusions:
- The choice of contacting technique is critical for managing thermal effects in high-power SESAMs.
- Novel substrate-transfer direct bonding offers a pathway to highly stable, large-area SESAMs for demanding laser applications.
- These advanced SESAMs are enabling components for future kilowatt-level ultrafast laser oscillators.

