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Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
Do Hyun Kim1, Hyeon Gyun Yoo1, Sung Min Hong2
1Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
Advanced Materials (Deerfield Beach, Fla.)
|July 21, 2016
Summary
Ultrathin flexible NAND flash memory was successfully fabricated using roll-to-plate packaging. This novel approach ensures reliable operation and excellent flexibility for advanced electronic applications.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Devices
Background:
- Flexible electronics demand novel memory solutions.
- Ultrathin silicon-based NAND flash memory offers potential for miniaturization and conformability.
Purpose of the Study:
- To demonstrate an ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND).
- To utilize roll-to-plate packaging for fabricating the flexible memory device.
Main Methods:
- Employing roll-based thermo-compression bonding with anisotropic conductive film (ACF).
- Transferring and interconnecting the f-NAND onto a flexible printed circuit board.
Main Results:
- Successful fabrication of a 16 × 16 f-NAND device.
- Demonstrated reliable circuitry operation with excellent flexibility.
- Confirmed stable interconnections using ACF bonding.
Conclusions:
- Roll-to-plate packaging is a viable method for producing flexible NAND flash memory.
- The developed f-NAND exhibits promising characteristics for flexible electronic systems.
