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Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications
Aftab M Hussain1, Muhammad M Hussain2
1Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955, Saudi Arabia.
Abstract:
A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
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