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Micro/nanoscale electrohydrodynamic printing: from 2D to 3D.

Bing Zhang¹, Jiankang He¹, Xiao Li²

¹State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi 710049, China. jiankanghe@mail.xjtu.edu.cn.

|August 2, 2016

Summary

Electrohydrodynamic printing (EHDP) advances from 2D to 3D microfabrication by integrating layer-by-layer stacking. This review explores 3D EHDP for creating complex microdevices, highlighting challenges and future directions in additive manufacturing.

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Area of Science:

Materials Science
Nanotechnology
Additive Manufacturing

Background:

Electrohydrodynamic printing (EHDP) excels at creating 2D micro/nanoscale patterns but is limited for 3D applications.
Growing demand for 3D microdevices necessitates advanced fabrication techniques beyond traditional 2D EHDP.
Additive manufacturing principles offer a pathway to overcome EHDP's 2D limitations.

Purpose of the Study:

To review the translation of 2D EHDP into a viable 3D micro/nanoscale printing strategy.
To discuss the working principles, components, and parameters of EHDP for 3D applications.
To highlight recent advancements and future challenges in 3D EHDP for freeform fabrication.

Main Methods:

Review of existing literature on EHDP techniques, focusing on 2D to 3D translation.

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Published on: January 31, 2019

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Analysis of solution-based and melt-based 3D EHDP in cone-jet and microdripping modes.

Discussion of critical process parameters and essential components for 3D EHDP.

Main Results:

EHDP is successfully adapted for 3D microfabrication through layer-by-layer stacking.
Explorations cover solution-based and melt-based 3D EHDP for diverse materials.
Fabrication of multimaterial structures, microelectronics, and biological constructs demonstrated.

Conclusions:

3D EHDP offers a promising route for fabricating complex micro/nanoscale structures.
Further research is needed to address challenges in translating 3D EHDP into a mainstream additive manufacturing strategy.
Freeform fabrication of 3D structures using 3D EHDP holds significant potential for future microdevice development.