Hybrid Copper-Silver Conductive Tracks for Enhanced Oxidation Resistance under Flash Light Sintering

We developed a simple method to prepare hybrid copper-silver conductive tracks under flash light sintering. The developed metal nanoparticle-based ink is convenient because its preparation process is free of any tedious washing steps. The inks were composed of commercially available copper nanoparticles which were mixed with formic acid, silver nitrate, and diethylene glycol. The role of formic acid is to remove the native copper oxide layer on the surface of the copper nanoparticles. In this way, it facilitates the formation of a silver outer shell on the surface of the copper nanoparticles through a galvanic replacement. In the presence of formic acid, the copper nanoparticles formed copper formate, which was present in the unsintered tracks. However, under illumination by a xenon flash light, the copper formate was then converted to copper. Moreover, the resistance of the copper-only films increased by 6 orders of magnitude when oxidized at high temperatures (∼220 °C). However, addition of silver nitrate to the inks suppressed the oxidation of the hybrid copper-silver films, and the resistance changes in these inks at high temperatures were greatly reduced. In addition, the hybrid inks proved to be advantageous for use in electrical circuits as they demonstrated a stable electrical conductivity after exposure to ambient air at 180 °C.