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Paper-Based Inkjet-Printed Flexible Electronic Circuits.

Yan Wang1, Hong Guo1, Jin-Ju Chen1

  • 1State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China , Chengdu, 610054, P. R. China.

ACS Applied Materials & Interfaces
|September 2, 2016
PubMed
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Researchers developed a low-cost method for creating highly conductive flexible electronic circuits on Teslin paper. This technique enables durable, foldable circuits suitable for applications like RFID tags and 3D devices.

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Printed flexible electronics are crucial for next-generation devices.
  • High conductivity and durability are key challenges in flexible circuit fabrication.
  • Existing methods often involve complex or expensive processes.

Purpose of the Study:

  • To develop a simple, low-cost method for fabricating highly conductive flexible electronic circuits.
  • To demonstrate the functionality and durability of these circuits under mechanical stress.
  • To explore the potential applications of the developed technology.

Main Methods:

  • Utilizing Teslin paper as a substrate, pre-treated with stannous chloride (SnCl2) colloidal solution to manage ink absorption.
  • Employing inkjet printing for catalyst ink deposition.
Keywords:
copperelectroless depositionflexible electronicsinkjet printingpaper-based

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  • Conducting low-temperature electroless copper deposition to form conductive circuits.

    • Main Results:

    • Achieved high conductivity of 4.0 × 10^7 S·m^-1, approximately 70% of bulk copper.
    • Fabricated flexible electronic circuits that maintain functionality after repeated folding and at various folding angles.
    • Demonstrated a successful low-cost, scalable fabrication process.

    Conclusions:

    • The developed method offers a viable route to low-cost, high-conductivity flexible electronics.
    • The circuits exhibit excellent mechanical robustness, suitable for demanding applications.
    • This technology holds significant promise for 3D electronics and disposable RFID tags.