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Updated: Mar 15, 2026
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
A Flexible and Robust Transparent Conducting Electrode Platform Using an Electroplated Silver Grid/Surface-Embedded
Junho Jang, Hyeon-Gyun Im, Jungho Jin1
1School of Materials Science and Engineering, University of Ulsan , Ulsan, Republic of Korea.
Abstract:
In this paper, we report flexible transparent conducting electrode (TCE) film using a silver grid (Ag grid)/silver nanowire (AgNW) hybrid structure (AG/NW-GFRHybrimer). The AG/NW-GFRHybrimer consists of an AgNW-embedded glass-fabric reinforced plastic film (AgNW-GFRHybrimer) and an electroplated Ag grid. The AgNW-GFRHybrimer is used as a flexible transparent substrate and a seed layer for electroplating. The Ag grid is fabricated via an all-solution-process; the grid pattern is formed using conventional photolithography, and Ag is deposited through electroplating. The AG/NW-GFRHybrimer exhibits excellent opto-electrical properties (transparency = 87%, sheet resistance = 13 Ω/□), superior thermal stability (250 °C for 720 min and 85 °C/85% RH for 100 h), and outstanding mechanical flexibility (bending radius = 1 mm for 2000 cycles). Finally, a touch-screen panel (four-wire resistive type) was fabricated using the AG/NW-GFRHybrimer to demonstrate its potential for use in actual optoelectronic applications.
