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Solid-state 3D imaging using a 1nJ/100ps laser diode transmitter and a single photon receiver matrix
Optics Express
|September 24, 2016
Summary
This study introduces a flexible 3D imaging system using pulsed time-of-flight focal plane imaging. The novel design offers adaptable performance for various applications, paving the way for solid-state 3D imaging solutions.
Area of Science:
- Optics and Photonics
- Solid-State Imaging Technology
- 3D Sensing
Background:
- Traditional 3D imaging systems often lack flexibility in performance parameters.
- Pulsed time-of-flight (ToF) imaging offers depth information but can be limited by system design.
- The need for adaptable and solid-state 3D imaging solutions is growing across various applications.
Purpose of the Study:
- To present a novel 3D imaging concept based on pulsed time-of-flight focal plane imaging.
- To demonstrate a flexible system design that allows tailoring of performance parameters like range, resolution, and frame rate.
- To explore the potential of this technology as a solid-state 3D imaging solution.
Main Methods:
- Utilized a laser diode in enhanced gain-switching mode for generating short, high-energy pulses (~100 ps FWHM, nJ).
- Developed a receiver comprising 2D Single-Photon Avalanche Diode (SPAD) and Time-to-Digital Converter (TDC) arrays on a single die.
- Implemented paraxial optics for field-of-view illumination and receiver placement at the focal plane.
Main Results:
- A prototype system was successfully built and tested using an 870nm laser and a 9x9 SPAD array with a 10-channel TDC.
- The system demonstrated the feasibility of pulsed ToF focal plane imaging with flexible performance.
- Initial results validate the potential for high-quality 3D data acquisition.
Conclusions:
- The presented pulsed time-of-flight focal plane imaging concept is a viable approach for flexible 3D imaging.
- The prototype validates the potential for a compact, solid-state 3D imaging system.
- Further development could lead to widespread adoption in applications requiring adaptable 3D sensing.

