Solid-state 3D imaging using a 1nJ/100ps laser diode transmitter and a single photon receiver matrix

A 3D imaging concept based on pulsed time-of-flight focal plane imaging is presented which can be tailored flexibly in terms of performance parameters such as range, image update rate, field-of-view, 2D resolution, depth accuracy, etc. according to the needs of different applications. The transmitter is based on a laser diode operating in enhanced gain-switching mode with a simple MOS/CMOS-switch current driver and capable of producing short (~100ps FWHM) high energy (up to nJ) pulses at a high pulsing rate. The receiver consists of 2D SPAD and TDC arrays placed on the same die, but in separate arrays. Paraxial optics can be used to illuminate the target field-of-view with the receiver placed at the focal plane of the receiver lens. To validate the concept, a prototype system is presented with a bulk laser diode/MOS driver operating at a wavelength of 870nm with a pulsing rate of 100kHz as the transmitter and a single-chip 9x9 SPAD array with 10-channel TDC as the receiver. The possibility of using this method as a solid-state solution to the task of 3D imaging is discussed in the light of the results derived from this prototype.