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Highly stable, extremely high-temperature, nonvolatile memory based on resistance switching in polycrystalline Pt
Hiroshi Suga1, Hiroya Suzuki1, Yuma Shinomura1
1Department of Technology of Chiba Institute of Technology, 2-17-1 Tsudanuma, Narashino, Chiba 275-0016, Japan.
Scientific Reports
|October 12, 2016
Summary
Researchers developed highly stable, nonvolatile, high-temperature memory using a platinum nanogap. This novel memory operates reliably at 873 K, overcoming limitations of conventional semiconductor memory.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Conventional semiconductor memory devices have limited operating temperature ranges.
- High-temperature electronics require memory solutions that maintain stability and nonvolatility under extreme thermal conditions.
Purpose of the Study:
- To develop a highly stable, nonvolatile, high-temperature memory device.
- To investigate the use of a polycrystalline platinum (Pt) nanogap for resistance switching memory applications.
Main Methods:
- Fabrication of a polycrystalline platinum (Pt) nanogap structure.
- Characterization of the nanogap's resistance switching properties at elevated temperatures.
- Analysis of the nanogap's structural stability and electrical performance up to 873 K.
Main Results:
- Achieved highly stable and nonvolatile resistance switching memory at temperatures up to 873 K.
- Demonstrated stable ON and OFF currents with less than 10% fluctuation for over eight hours at 873 K.
- Identified that a sharp-edged Pt crystal facet in the nanogap enhances operating temperature and electric field concentration.
Conclusions:
- The Pt nanogap memory exhibits exceptional high-temperature performance and stability.
- The nanogap design, featuring sharp Pt crystal facets, is crucial for high-temperature operation and secure electrical field management.
- This technology offers a promising solution for nonvolatile memory in extreme temperature environments.

