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A novel high-throughput fatigue testing method for metallic thin films.

Sofie Burger1, Christoph Eberl1, Alexander Siegel2

  • 1Institute for Applied Materials, Karlsruhe Institute of Technology (KIT), Kaiserstr 12, 76131, Karlsruhe, Germany.

Science and Technology of Advanced Materials
|November 24, 2016
PubMed
Summary

This study introduces a new fatigue testing method for metallic thin films. The technique uses a vibrating cantilever to efficiently measure fatigue life across a range of stress amplitudes.

Keywords:
beam bendingfatiguehigh-throughputmaterials libraries combinatorial methodologythin films

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Solid Mechanics

Background:

  • Metallic thin films are crucial for computing and communication technologies.
  • Understanding their fatigue behavior and the influence of alloying elements is essential but limited.
  • Current fatigue testing methods for thin films are often time-consuming and provide limited data.

Purpose of the Study:

  • To present a novel, high-throughput experimental method for characterizing fatigue behavior in metallic thin films.
  • To enable efficient generation of lifetime diagrams for thin films under varying stress conditions.
  • To facilitate the study of how alloying elements affect thin film fatigue properties.

Main Methods:

  • Development of a high-throughput fatigue testing apparatus utilizing a vibrating cantilever.
  • Application of thin films to the surface of the vibrating cantilever.
  • Measurement of fatigue-induced damage progression along the cantilever to determine lifetime.
  • Leveraging the linear decrease in surface strain amplitude from the fixed to the free end of the cantilever.

Main Results:

  • The novel method successfully generates fatigue lifetime data for metallic thin films.
  • Each tested cantilever yields a comprehensive lifetime diagram by tracking damage fronts.
  • The technique allows for testing up to 10^8 load cycles, providing extensive fatigue data.
  • The method demonstrates the feasibility of studying fatigue behavior under a gradient of strain and stress amplitudes.

Conclusions:

  • The presented vibrating cantilever method offers an efficient approach for thin film fatigue testing.
  • This technique provides valuable insights into the fatigue behavior of metallic thin films, crucial for electronic applications.
  • The methodology can be adapted to investigate the impact of various alloying elements on thin film durability.