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Electrochemical Etching and Characterization of Sharp Field Emission Points for Electron Impact Ionization
Published on: July 12, 2016
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Bulk molybdenum field emitters by inductively coupled plasma etching
Ningli Zhu1, Matthew T Cole2, William I Milne3
1Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China. j.chen@pku.edu.cn and Electrical Engineering Division, Department of Engineering, University of Cambridge, UK.
Physical Chemistry Chemical Physics : PCCP
|November 29, 2016
Summary
Researchers fabricated inductively coupled plasma (ICP) etched molybdenum field emitter arrays. Optimized etching achieved high aspect ratios and 25.5 nm-radius tips for enhanced field electron emission performance.
Area of Science:
- Materials Science
- Nanotechnology
- Physics
Background:
- Field emitter arrays are crucial for vacuum microelectronic devices.
- Molybdenum is a promising material for field emitters due to its properties.
- Fabrication techniques directly impact emitter performance and uniformity.
Purpose of the Study:
- To report the fabrication of inductively coupled plasma (ICP) etched, diode-type, bulk molybdenum field emitter arrays.
- To systematically investigate emitter etching conditions based on mask geometry and process parameters.
- To assess the field electron emission performance of the fabricated arrays.
Main Methods:
- Inductively coupled plasma (ICP) etching was employed for molybdenum.
- Emitter etching conditions were varied concerning etch mask geometry and process parameters.
- Characterization of tip radius and aspect ratio was performed.
Main Results:
- Optimized etching conditions yielded high uniformity and aspect ratios greater than 10.
- Field emitter arrays with 25.5 nm-radius tips were successfully fabricated using aperture masks (4.45 μm diameter).
- The field electron emission performance of the fabricated molybdenum tips was evaluated.
Conclusions:
- ICP etching is an effective method for fabricating high-performance molybdenum field emitter arrays.
- Precise control over etching parameters and mask design is critical for achieving desired tip geometry and uniformity.
- The developed fabrication process shows potential for applications requiring efficient field electron emission.

