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Fabricating Metallic Circuit Patterns on Polymer Substrates through Laser and Selective Metallization.

Jihai Zhang1, Tao Zhou1, Liang Wen1

  • 1State Key Laboratory of Polymer Materials Engineering of China, Polymer Research Institute, Sichuan University , Chengdu 610065, China.

ACS Applied Materials & Interfaces
|December 15, 2016
PubMed
Summary

Researchers developed a new method for creating high-resolution metallic circuits on polymers using laser direct structuring (LDS) of copper hydroxyl phosphate. This process ensures strong adhesion for advanced electronics and printed circuit boards.

Keywords:
copper hydroxyl phosphatelaser direct structuringmetallizationnear-infrared pulsed laserpolymer

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Nanotechnology

Background:

  • Fabricating robust metallic circuits on polymers is crucial for portable electronics, wearables, and bioelectronics.
  • Existing methods often struggle with achieving strong adhesion and high resolution.

Purpose of the Study:

  • To develop a novel, environmentally friendly method for high-resolution metallic circuit fabrication on polymer substrates.
  • To investigate the mechanism behind selective metallization using laser direct structuring (LDS).

Main Methods:

  • Laser direct structuring (LDS) using copper hydroxyl phosphate [Cu2(OH)PO4] precursor.
  • Near-infrared (NIR) pulsed laser irradiation (1064 nm).
  • X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM), and micro-Raman spectroscopy for analysis.

Main Results:

  • Selective formation of elemental copper (Cu0) via photochemical reduction of Cu2(OH)PO4 under NIR laser irradiation.
  • Cu0 acted as catalytic centers for successful electroless plating and selective metallization.
  • SEM confirmed physical anchoring of copper layers into the polymer, ensuring excellent adhesion.
  • Micro-Raman imaging showed amorphous carbon generation and a reaction zone of approximately 40 μm.

Conclusions:

  • The developed LDS method enables high-resolution metallic circuit fabrication on polymers with superior adhesion.
  • The process relies on the photochemical reduction of copper hydroxyl phosphate to initiate selective electroless plating.
  • This technique offers a promising, eco-friendly approach for applications in the printed circuit plate (PCB) industry.