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Two-dimensional WS2 nanoribbon deposition by conversion of pre-patterned amorphous silicon
Markus H Heyne1,2,3, Jean-François de Marneffe3, Annelies Delabie1,3
1Chemistry Department, KU Leuven, Celestijnenlaan 200F, 3001 Leuven, Belgium.
Nanotechnology
|December 16, 2016
Summary
We developed a method for area selective deposition of 2D tungsten disulfide (WS₂) nanoribbons. This technique allows tunable thickness and controlled alignment on dielectric substrates for advanced electronic applications.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- Two-dimensional (2D) materials like tungsten disulfide (WS₂) offer unique electronic and optical properties.
- Precise control over the deposition and orientation of 2D materials is crucial for device fabrication.
- Existing methods for WS₂ deposition often lack area selectivity or control over thickness and alignment.
Purpose of the Study:
- To develop a novel method for area selective deposition of 2D WS₂ nanoribbons.
- To achieve tunable thickness and controlled orientation of WS₂ nanoribbons on dielectric substrates.
- To enable the fabrication of advanced electronic and optoelectronic devices using precisely patterned WS₂.
Main Methods:
- Area selective deposition using a complete conversion of a pre-patterned, H-terminated Si layer to metallic W via WF₆.
- In situ sulfidation of the metallic W layer using H₂S at 450 °C to form WS₂ nanoribbons.
- Rapid thermal annealing at 900 °C under inert gas to achieve parallel alignment of WS₂ basal planes.
Main Results:
- Successful area selective deposition of 2D WS₂ nanoribbons down to 20 nm in lateral dimension.
- Tunable nanoribbon thickness controlled by the initial Si layer thickness.
- Random basal plane orientation achieved initially, followed by parallel alignment to the substrate after annealing.
- Demonstration of a method for controlled growth and patterning of WS₂.
Conclusions:
- The presented method enables precise, area selective deposition of WS₂ nanoribbons with tunable thickness.
- Controlled alignment of WS₂ basal planes is achievable through post-deposition annealing.
- This technique provides a pathway for fabricating high-performance 2D WS₂-based devices.

