Endoscopic management of the schneiderian membrane perforation during transcrestal sinus augmentation: a case report

M Andreasi Bassi1, C Andrisani2, S Lico3

  • 1Private practice in Rome, Italy.

ORAL & Implantology
|January 3, 2017
PubMed
Abstract

Insights

This study presents an endoscopic technique to repair incidental tears of the Schneiderian membrane (SM) during transcrestal sinus lifts. The method successfully facilitated bone grafting and dental implant placement, ensuring a stable outcome.

Area of Science:

  • Dentistry
  • Oral Surgery
  • Regenerative Medicine

Background:

  • Sinus lift procedures, particularly the transcrestal approach, carry a risk of incidental Schneiderian membrane (SM) tears.
  • Tears in the SM can compromise the success of bone grafting and subsequent dental implant placement.
  • Effective management of SM perforations is crucial for predictable outcomes in sinus augmentation.

Observation:

  • A novel endoscopic technique was employed to repair an incidentally torn SM during a transcrestal sinus lift.
  • The repair involved detaching the SM, placing a collagen sponge, and inserting graft material, all under endoscopic visualization.
  • Simultaneous dental implant placement was performed following successful graft elevation.

Findings:

  • Post-operative endoscopic examination revealed a normal-appearing SM with no inflammation and a clear sinus.
  • Radiographic analysis showed progressive radiopacity increase and volume decrease in the grafted area, indicating successful bone integration and remodeling.
  • The dental implant achieved osseointegration, leading to successful prosthetic restoration.

Implications:

  • Endoscopic repair of SM tears offers a minimally invasive and effective solution during transcrestal sinus lifts.
  • This technique can help salvage procedures complicated by membrane perforations, improving graft success rates.
  • Routine use of endoscopy for SM repair may enhance predictability and reduce complications in sinus augmentation surgery.