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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

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In situ imaging of microstructure formation in electronic interconnections.

M A A Mohd Salleh^1,2,3, C M Gourlay³, J W Xian³

¹Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, 4072 St Lucia, Queensland, Australia.

Scientific Reports

|January 13, 2017

Summary

This study used synchrotron radiography to investigate solder paste reactions on printed circuit boards. It revealed rapid formation of the copper-tin intermetallic layer and detailed the growth dynamics of solder microstructure.

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A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens

A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens

Published on: June 2, 2017

Area of Science:

Materials Science
Metallurgy
Surface Science

Background:

Understanding solder-substrate interactions is crucial for electronics reliability.
Microstructural evolution during soldering impacts joint performance and longevity.
Copper-tin intermetallic compound (IMC) formation is a key aspect of solder joint development.

Purpose of the Study:

To investigate the real-time microstructural development during solder paste melting, wetting, and solidification on copper-plated printed circuit boards.
To analyze the kinetics of interfacial copper-tin intermetallic compound (Cu₆Sn₅) formation and flux voiding.
To quantify the nucleation and growth mechanisms of primary Cu₆Sn₅ crystals.

Main Methods:

Synchrotron radiography was employed for in-situ, high-resolution imaging of the soldering process.
Two solder compositions, Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu, were studied.
Kinetic analysis of interfacial reactions and crystal growth was performed.

Main Results:

The interfacial Cu₆Sn₅ layer formed rapidly, within 0.05 seconds of wetting.
Flux void formation kinetics at the liquid/Cu₆Sn₅ interface were explored.
A competition between homogeneous nucleation of Cu₆Sn₅ in the solder and heterogeneous growth from the existing IMC layer was observed.
Beta-tin (β-Sn) nucleation was confirmed to occur at or near the Cu₆Sn₅ layer in Sn-3.0Ag-0.5Cu/Cu joints.

Conclusions:

The study provides detailed insights into the rapid interfacial reactions and microstructural evolution during solder paste processing.
Understanding these mechanisms is vital for optimizing solder joint formation and enhancing the reliability of electronic assemblies.
The findings highlight the complex interplay between nucleation and growth kinetics in determining the final solder microstructure.