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Growth and Optical Properties of Direct Band Gap Ge/Ge0.87Sn0.13 Core/Shell Nanowire Arrays
S Assali1, A Dijkstra1, A Li1,2,3
1Department of Applied Physics, Eindhoven University of Technology , 5600 MB Eindhoven, The Netherlands.
Nano Letters
|February 7, 2017
Summary
Direct band gap germanium-tin (GeSn) alloys grown as core/shell nanowires enable new Group IV optoelectronic devices. This nanowire structure enhances material quality, leading to efficient short-wave infrared photodetectors.
Area of Science:
- Semiconductor Physics
- Materials Science
- Optoelectronics
Background:
- Group IV semiconductor optoelectronics are advancing with Germanium-Tin (GeSn) alloys.
- Achieving strain-free, direct band gap GeSn with high Tin (Sn) content (>9%) on Ge/Si virtual substrates is crucial.
Purpose of the Study:
- To demonstrate the growth of Ge/GeSn core/shell nanowire arrays with high Sn incorporation.
- To investigate the impact of nanowire geometry on strain relaxation and defect formation in GeSn alloys.
- To evaluate the optoelectronic properties of GeSn nanowires for infrared applications.
Main Methods:
- Growth of Ge/GeSn core/shell nanowire arrays using advanced deposition techniques.
- Characterization of material composition, crystal structure, and strain using techniques like Transmission Electron Microscopy (TEM) and X-ray Diffraction (XRD).
- Photoluminescence (PL) spectroscopy and optical absorption measurements at room temperature.
Main Results:
- Successful growth of Ge/GeSn core/shell nanowires with up to 13% Sn incorporation, free from Sn clusters.
- Nanowire geometry effectively relaxes strain and minimizes structural defects in the Ge0.87Sn0.13 shell.
- Observed room-temperature photoluminescence centered at 0.465 eV and over 98% optical absorption.
Conclusions:
- Direct band gap GeSn alloys in a nanowire geometry offer a promising pathway for Group IV optoelectronics.
- The developed GeSn nanowires are suitable for low-cost, high-efficiency photodetectors in the short-wave infrared spectrum.
- This approach paves the way for advanced thermal imaging devices and other infrared optoelectronic applications.

