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Preface: Special Topic on Atomic and Molecular Layer Processing: Deposition, Patterning, and Etching.

James R Engstrom1, Andrew C Kummel2

  • 1Robert F. Smith School of Chemical and Biomolecular Engineering, Cornell University, Ithaca, New York 14853, USA.

The Journal of Chemical Physics
|February 10, 2017
PubMed
Summary
This summary is machine-generated.

Advanced thin film processing utilizes atomic and molecular control for fabrication. This research explores surface phenomena and energetic species crucial for understanding and developing these cutting-edge technologies.

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Area of Science:

  • Materials Science
  • Surface Science
  • Chemical Physics

Background:

  • Traditional fabrication methods are reaching fundamental limits.
  • Thin film processing requires atomic and molecular scale control.
  • Surface phenomena like adsorption and reactions are central to thin film processing.

Purpose of the Study:

  • To unravel mechanistic details of atomic and molecular layer processing.
  • To provide a framework for the development of advanced thin film technologies.
  • To identify challenges and future research directions in atomic and molecular layer manipulation.

Main Methods:

  • Theoretical and computational modeling.
  • Experimental probes including X-ray synchrotron radiation.
  • Spectroscopic techniques like photoelectron and infrared spectroscopy.

Main Results:

  • Detailed mechanistic insights into atomic and molecular layer processing.
  • Understanding of surface phenomena involving energetic species.
  • Identification of key challenges in the field.

Conclusions:

  • Further research is needed to fully understand atomic and molecular scale interactions.
  • Advanced experimental and computational tools are essential for progress.
  • This work establishes a foundation for future developments in atomic and molecular layer fabrication.