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Bonding-induced thermal transport enhancement across a hard/soft material interface using molecular monolayers
Chao Yuan1, Mengyu Huang1, Yanhua Cheng1
1State Key Laboratory of Coal Combustion, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China. luoxb@hust.edu.cn.
Physical Chemistry Chemical Physics : PCCP
|February 28, 2017
Summary
A new strategy enhances interfacial thermal conductance (Gint) by 11-fold using covalent bonds between copper and epoxy. This method improves thermal transport in composites, outperforming previous phonon-matching techniques.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Manipulating thermal transport across hard/soft material interfaces is crucial for advanced composites.
- Existing strategies often focus on bridging phonon spectra mismatch using self-assembled monolayers (SAMs).
Purpose of the Study:
- To introduce a general strategy for enhancing interfacial thermal conductance (Gint) in interfaces incompatible with previous methods.
- To investigate the role of covalent bonding in thermal transport for copper/epoxy interfaces.
Main Methods:
- Utilizing a strongly bonding SAM to covalently connect copper and epoxy resin.
- Conducting thermal measurements to quantify Gint.
- Performing tensile strength and wettability tests to analyze interfacial bonding.
Main Results:
- Achieved up to an 11-fold enhancement in Gint for copper/epoxy interfaces.
- Observed a 2-fold decrease in Gint when using SAMs focused on phonon spectra match.
- Established a correlation between covalent bonding characteristics and Gint.
Conclusions:
- Covalent bonding is a more effective strategy than phonon spectra matching for tuning interfacial thermal transport in complex soft materials.
- The proposed strategy shows significant potential for manipulating thermal properties in nanocomposites.
