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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
A Thermal Model for Carbon Nanotube Interconnects
Kaji Muhammad Mohsin1, Ashok Srivastava2, Ashwani K Sharma3
1School of Electrical Engineering and Computer Science, Louisiana State University, Baton Rouge, LA 70803, USA. kmohsi1@lsu.edu.
Abstract:
In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT) interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.
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