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Method to simulate and analyse induced stresses for laser crystal packaging technologies
Optics Express
|April 7, 2017
Summary
A new simulation method assessed stresses in laser crystal packaging using solderjet bumping. Results show this low-stress technique minimally impacts laser beam quality, preserving polarization and wavelength.
Area of Science:
- Optical Engineering
- Materials Science
- Computational Mechanics
Background:
- Laser crystal packaging is critical for optical system performance.
- Traditional packaging methods can induce stress, affecting laser properties.
- The solderjet bumping technique offers a low-stress alternative for optics assembly.
Purpose of the Study:
- To develop and validate a simulation method for induced stresses in laser crystal packaging.
- To analyze the impact of a low-stress packaging technique on laser cavity birefringent effects.
- To evaluate the performance of laser cavities assembled using the solderjet bumping technique.
Main Methods:
- Thermo-mechanical simulations were performed using ANSYS 17.0 to model induced stresses.
- Simulation results were imported into VirtualLab Fusion for optical beam analysis.
- Analysis focused on wavelength and polarization of input and output laser beams.
Main Results:
- The simulation method effectively modeled stresses associated with laser crystal packaging.
- The solderjet bumping technique resulted in negligible differences between input and output laser beams.
- Birefringent effects within the laser cavity were found to be minimal.
Conclusions:
- The developed simulation method is suitable for assessing packaging-induced stresses in laser crystals.
- The solderjet bumping technique is a viable low-stress method for packaging laser optics.
- This technique preserves the integrity of laser beams, maintaining wavelength and polarization.