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Updated: Mar 3, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
Lin Jing, Majid Kabiri Samani1, Bo Liu
1Electronics Material and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology , SE-412 96 Gothenburg, Sweden.
Abstract:
We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ∼15.5 to 29.5 W/mK, ∼90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ∼3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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