Optical performance enhancement of chip-on-board light-emitting diodes through ionic wind patterning
Applied Optics
|April 22, 2017
Summary
This study introduces a new method to pattern encapsulation layers for chip-on-board light-emitting diodes (LEDs) using ionic wind. This technique significantly enhances light extraction efficiency (LEE) and simplifies manufacturing.
Area of Science:
- Optoelectronics
- Materials Science
- Nanotechnology
Background:
- Total internal reflection at encapsulation layers limits light extraction efficiency (LEE) in chip-on-board (COB) light-emitting diodes (LEDs).
- Patterning encapsulation layers is a known strategy to improve LEE.
Purpose of the Study:
- To propose and demonstrate a novel method for patterning LED encapsulation layers.
- To enhance the light extraction efficiency (LEE) of COB LEDs.
Main Methods:
- Utilized the interaction between ionic wind and liquid encapsulation to create patterned surfaces.
- Fabricated two specific encapsulation patterns: dual stripe and meniscus.
Main Results:
- Dual stripe and meniscus patterns improved LEE by 17.78% and 20.48% compared to flat structures.
- Achieved more uniform light intensity distributions with the patterned structures.
- Demonstrated a simplified fabrication process and reduced costs.
Conclusions:
- The ionic wind-driven liquid encapsulation patterning is an effective method to enhance LEE in COB LEDs.
- This novel approach offers a cost-effective and simplified solution for LED packaging.
- The developed patterns lead to improved light uniformity and efficiency.
