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Interleaved single-carrier frequency-division multiplexing for optical interconnects.

Ji Zhou, Yaojun Qiao, Jianjun Yu

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    This summary is machine-generated.

    A new real-valued interleaved single-carrier frequency-division multiplexing (I-SC-FDM) scheme offers lower computational complexity and reduced peak-to-average power ratio (PAPR) for optical interconnects. This I-SC-FDM technology is promising for cost- and power-sensitive applications.

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    Area of Science:

    • Optical communications
    • Signal processing
    • Telecommunications engineering

    Background:

    • Intensity-modulation and direct-detection (IM/DD) optical interconnects are crucial for modern data transmission.
    • Orthogonal frequency-division multiplexing (OFDM) is widely used but suffers from high computational complexity and peak-to-average power ratio (PAPR).

    Purpose of the Study:

    • To propose and evaluate a novel real-valued interleaved single-carrier frequency-division multiplexing (I-SC-FDM) scheme.
    • To reduce computational complexity and improve PAPR performance in optical interconnects.

    Main Methods:

    • Developed a simplified encoding structure for I-SC-FDM, reducing computational complexity from Nlog2N to N complex multiplications.
    • Analyzed PAPR performance against OFDM with QPSK and 16QAM at a complementary cumulative distribution function of 10^-2.
    • Experimentally demonstrated the I-SC-FDM scheme in optical interconnects.

    Main Results:

    • Achieved a reduction of 10 dB and 7.5 dB in PAPR for I-SC-FDM compared to QPSK- and 16QAM-OFDM, respectively (with 4096 subcarriers).
    • Successfully transmitted data at 12 Gbit/s over 22.5 km, 24 Gbit/s over 22.5 km, and 128 Gbit/s over 2.4 km using standard single-mode fiber.
    • Demonstrated significantly lower computational complexity for the proposed I-SC-FDM scheme.

    Conclusions:

    • The proposed I-SC-FDM scheme offers a viable solution for optical interconnects.
    • Its low computational complexity and low PAPR make it suitable for cost-sensitive and power-sensitive applications.