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Planar and Three-Dimensional Printing of Conductive Inks

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

Ultrasonically spray coated silver layers from designed precursor inks for flexible electronics.

W Marchal^1,2, G Vandevenne^2,3, J D'Haen^2,4

¹UHasselt, Hasselt University, Institute for Materials Research(IMO-IMOMEC), Inorganic and Physical Chemistry, Agoralaan, B-3590 Diepenbeek, Belgium.

|May 5, 2017

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Ultrasonic spray coating with novel metal organic decomposition inks enables fast, low-temperature deposition of conductive silver features on flexible materials. This breakthrough facilitates the development of advanced smart applications on heat-sensitive substrates.

Area of Science:

Materials Science
Nanotechnology
Electronics Engineering

Background:

Integrating electronic components onto flexible substrates like plastic, paper, and textiles is crucial for smart applications.
Developing rapid, straightforward deposition methods for conductive materials on temperature-sensitive surfaces remains a significant challenge.

Purpose of the Study:

To design and optimize novel metal organic decomposition (MOD) inks for depositing silver features using ultrasonic spray coating (USSC).
To evaluate the performance of USSC-deposited silver layers for flexible electronics.

Main Methods:

Screening various amine ligands to formulate stable MOD inks for silver deposition.
Utilizing ultrasonic spray coating (USSC) to deposit nanoparticle-free silver layers on plastic foils.

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Planar and Three-Dimensional Printing of Conductive Inks

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Characterizing the conductivity, stability, morphology, and adhesion of the deposited silver layers.

Investigating optimal deposition conditions within a low-temperature window (70 °C-120 °C).

Main Results:

Achieved silver layers with 15% bulk silver conductivity, excellent stability, morphology, and adhesion.
Demonstrated successful deposition on plastic foils at low temperatures (70 °C-120 °C) without post-sintering.
Produced smooth, semi-transparent silver layers with tunable thickness over large areas.
Identified optimal MOD ink formulations and USSC parameters.

Conclusions:

The combination of tailored MOD inks and USSC offers a promising high-throughput method for depositing conductive silver on heat-sensitive substrates and 3D objects.
This approach overcomes limitations of traditional methods, enabling advanced flexible electronics and smart applications.