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Optically Patternable Metamaterial Below Diffraction Limit.

Youngseop Lee, Sang-Gil Park, SeokJae Yoo1

  • 1Department of Physics, Korea University , 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea.

ACS Applied Materials & Interfaces
|May 25, 2017
PubMed
Summary
This summary is machine-generated.

We developed an optically patternable metamaterial for ultraviolet nanolithography. This novel photoresist enables sub-diffraction limit feature sizes using surface plasmon excitation.

Keywords:
meta-photoresistsubdiffraction limitsuperlens effectsurface plasmon excitationultraviolet nanolithography

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Optics

Background:

  • Conventional photolithography is limited by the diffraction of light.
  • Achieving feature sizes below the diffraction limit requires advanced techniques.

Purpose of the Study:

  • To report an optically patternable metamaterial (OPM) for ultraviolet nanolithography below the diffraction limit.
  • To demonstrate a new class of photoresist for sub-diffraction limit nanolithography.

Main Methods:

  • Fabrication of OPM using spin-coating, oblique angle deposition, and solid-state embedment.
  • Embedding monolayered silver nanoislands within a photosensitive polymer.
  • Utilizing surface plasmon excitation for photolithographic definition.

Main Results:

  • The OPM exhibits negative effective permittivity and high image contrast in the ultraviolet range.
  • Achieved a minimum feature size of 70 nm (approximately λ/5) beyond the near-field zone.
  • Demonstrated clear photolithographic definition enabled by surface plasmon excitation.

Conclusions:

  • The developed OPM is a novel photoresist for ultraviolet nanolithography.
  • This metamaterial overcomes the diffraction limit for nanoscale patterning.
  • Enables precise fabrication of sub-wavelength features.