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Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu

Xiaowei Zuo1,2, Congcong Zhao3,4, Lin Zhang5,6

  • 1Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, China. zuoxw@epm.neu.edu.cn.

Materials (Basel, Switzerland)
|August 5, 2017
PubMed

Keywords:
Ag-Cu eutectic alloyeutectic lamellar spacinggrowth ratemagnetic fieldmicrohardnessstrength

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