A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects

Weiwei Hu1,2, Yaqiu Li3, Yufeng Sun4

  • 1Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China. hww@buaa.edu.cn.

Summary

This study introduces a new thermal fatigue life prediction model for ball grid array packages. It accounts for load sequence effects and improves testing data accessibility for microelectronic devices.

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