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A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects
Weiwei Hu1,2, Yaqiu Li3, Yufeng Sun4
1Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China. hww@buaa.edu.cn.
Abstract:
Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper proposes a thermal fatigue life prediction model for ball grid array (BGA) packages to take into consideration the load sequence effects. For the purpose of improving the availability and accessibility of testing data, a new failure criterion is discussed and verified by simulation and experimentation. The consequences for the fatigue underlying sequence load conditions are shown.
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