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Updated: Feb 25, 2026

Elaborate Control of Inkjet Printer for Fabrication of Chip-based Supercapacitors
Published on: November 30, 2021
Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates
Bolin Chen1, Yizhou Jiang2, Xiaohui Tang1
1Department of Mechanical Engineering, Iowa State University , Ames, Iowa 50011, United States.
Abstract:
The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.
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