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Related Experiment Video

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Multiscale Microstructures and Microstructural Effects on the Reliability of Microbumps in Three-Dimensional

Zhiheng Huang1, Hua Xiong2, Zhiyong Wu3

  • 1School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou 510275, China. hzh29@mail.sysu.edu.cn.

Materials (Basel, Switzerland)
|August 10, 2017
PubMed
Summary

This study simulates microbump microstructures, revealing how size and stress impact reliability. Smaller microbumps exhibit more heterogeneous structures, affecting mechanical stress and electromigration resistance.

Keywords:
3D integrationmicrobumpmultiscale microstructurereliability

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Area of Science:

  • Materials Science
  • Semiconductor Manufacturing
  • Computational Modeling

Background:

  • Three-dimensional integration relies on microbumps, whose microscopic dimensions necessitate multiscale microstructure analysis.
  • Understanding microstructural evolution is crucial for predicting the reliability of microelectronic devices.

Purpose of the Study:

  • To investigate the multiscale microstructures of microbumps using advanced simulation techniques.
  • To analyze the influence of microstructural features on mechanical stress and electromigration reliability.

Main Methods:

  • Phase field and phase field crystal models were employed for simulating mesoscale and atomic-scale microstructures.
  • Coupled modeling of microstructure, mechanical stress, and electromigration was performed.

Main Results:

  • Microbump size and geometry significantly influence mesoscale and atomic-scale microstructural formation during solidification.
  • External stress can induce ordered phase growth at microbump boundaries.
  • Smaller microbumps display more heterogeneous microstructures due to solidification, phase separation, and coarsening.
  • Variations in microstructure lead to differing von Mises stress distributions across microbumps of various sizes and geometries.

Conclusions:

  • Microstructural heterogeneity in smaller microbumps impacts mechanical stress distribution.
  • The interplay between phase morphology connectivity and interface presence in mesoscale microstructures is critical for electromigration reliability.