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Conformal Electronics Wrapped Around Daily Life Objects Using an Original Method: Water Transfer Printing.

Brice Le Borgne1, Olivier De Sagazan1, Samuel Crand1

  • 1UMR CNRS 6164, Institut d'Électronique et des Télécommunications de Rennes, Université Rennes 1, , Campus de Beaulieu, 35042 Rennes Cedex, France.

ACS Applied Materials & Interfaces
|August 24, 2017
PubMed
Summary

Water transfer printing enables seamless film application on 3D objects without rigid substrates. This technology facilitates conformal electronics and flexible device integration, as shown by a bent touchpad prototype.

Keywords:
additive transferconformal electronicscurvilinear electronicsflexible electronicswater transfer printing

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Conformal Electronics

Background:

  • Traditional methods struggle with applying films to complex 3D surfaces.
  • Achieving fold-free patterns on non-planar and holed objects remains a significant challenge.
  • Integrating large-area flexible films onto everyday objects requires advanced transfer techniques.

Purpose of the Study:

  • To demonstrate an industrially viable water transfer printing method for patterned films on 3D objects.
  • To overcome limitations of rigid substrates in film transfer processes.
  • To showcase the potential for conformal electronics and flexible device integration.

Main Methods:

  • Utilizing water transfer printing to apply metallic and polymeric films.
  • Transferring patterned films onto various materials, including complex geometries.
  • Fabricating a bent capacitive touchpad to demonstrate application.

Main Results:

  • The method successfully wrapped films around diverse materials without folds, even on holed objects.
  • High film bending properties were achieved.
  • The technique proved effective for integrating large-area films onto daily objects.

Conclusions:

  • Water transfer printing is a promising technology for applying patterned films to complex 3D surfaces.
  • This method addresses key challenges in conformal electronics and flexible device fabrication.
  • The successful creation of a bent touchpad highlights the practical applications of this technique.