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Material Viscoelasticity-Induced Drift of Micro-Accelerometers.
Wu Zhou1, Peng Peng2, Huijun Yu3
1School of Mechatronics Engineering, University of Electronic Technology and Science of China, Chengdu 611731, China. zhouwu916@uestc.edu.cn.
Materials (Basel, Switzerland)
|September 15, 2017
Summary
This study reveals that the viscoelastic properties of polymer adhesives cause micro-accelerometer drift over time. Higher temperatures exacerbate this drift, impacting micro-device reliability.
Area of Science:
- Materials Science
- Mechanical Engineering
- Micro-system Packaging
Background:
- Polymer adhesives are crucial for micro-system packaging, bonding die chips to substrates.
- Adhesive properties significantly influence micro-device stability and reliability.
- Long-term performance drift in micro-devices is a critical concern.
Purpose of the Study:
- To investigate the viscoelasticity of polymer adhesives as a cause of micro-accelerometer drift.
- To quantify the impact of adhesive viscoelasticity on micro-accelerometer performance over time and temperature.
- To establish a predictive model for micro-accelerometer drift.
Main Methods:
- Finite Element (FE) modeling was used to simulate structural deformation and stress development.
- Dynamic Mechanical Analysis (DMA) determined adhesive viscoelastic properties through stress-relaxation experiments.
- DMA data was integrated into the FE model for drift prediction.
Main Results:
- FE modeling predicted micro-accelerometer drift due to packaging stress from thermal mismatch and adhesive viscoelasticity.
- Experimental results validated the FE model's predictions.
- Accelerometers showed continuous zero offset and sensitivity drift at room temperature due to viscoelasticity.
Conclusions:
- Adhesive viscoelasticity is a primary driver of long-term micro-accelerometer output drift.
- Temperature significantly influences the rate and magnitude of accelerometer drift.
- Understanding and modeling adhesive viscoelasticity is essential for reliable micro-device design.
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