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Updated: Feb 22, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Jingzhi Shang1,2, Chunxiao Cong3, Zilong Wang2
1NanjingTech-NTU Joint Center of Research and Development, Nanjing Tech University, Nanjing, 211816, China.
Room-temperature lasing from two-dimensional (2D) semiconductors is now possible in vertical-cavity surface-emitting lasers (VCSELs). This breakthrough enables practical 2D semiconductor lasers for on-chip optical applications.
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