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Metallic Solids02:37

Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
21.0K

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Conductive One- and Two-Dimensional Structures Fabricated Using Oxidation-Resistant Cu-Sn Particles.

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  • 1DuPont Electronic Technologies , Research Triangle Park, North Carolina 27709, United States.

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|September 27, 2017
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Copper-tin (Cu-Sn) powders offer a low-cost, oxidation-resistant alternative to silver and gold in electronics. CuSn0.1 wires show conductivity similar to copper, while CuSn0.1 films demonstrate superior stability in air.

Keywords:
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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Silver and gold are traditional conductors in electronics but are expensive and prone to oxidation.
  • Copper-tin (Cu-Sn) powders present a cost-effective and oxidation-resistant alternative.
  • Understanding the electrical properties of Cu-Sn in various forms is crucial for their application.

Purpose of the Study:

  • To investigate the electrical resistivity of one-dimensional (wires) and two-dimensional (films) copper-tin structures.
  • To evaluate the temperature-dependent resistivity of Cu-Sn materials.
  • To assess the oxidation resistance of Cu-Sn films compared to pure copper films.

Main Methods:

  • Fabrication of CuSny (y = atom ratio of Sn/Cu) wires and films using direct printing.
  • In situ measurement of structural resistivities from 2 to 400 K under oxygen-free conditions.
  • Heating experiments at 573 K in ambient air to evaluate film stability.

Main Results:

  • CuSn0.1 wires exhibited electrical resistivities comparable to pure copper wires.
  • CuSn0.1 films demonstrated significantly lower increases in resistivity after thermal stress in air compared to pure copper films.
  • The study provides essential data on the conductivity and stability of Cu-Sn nanostructures.

Conclusions:

  • Copper-tin alloys, particularly CuSn0.1, are viable alternatives to traditional conductors in electronic applications.
  • The enhanced oxidation resistance of CuSn0.1 films makes them suitable for demanding environments.
  • Direct printing offers a scalable method for producing these promising conductive materials.