Dual-angle, spectral reconstruction imaging method for the determination of dielectric thin-film thickness

The thickness of optical thin films, such as dielectrics, can be determined by the use of a profilometer or by a spectrophotometer. Both of these standard methods have coated area size limitations. Converting a digital camera to a spectrophotometer eliminates these size limitations. This work reviews a simple method for determining the physical thickness of a dielectric film on a silicon wafer using two images from a digital camera.