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All-electronic Nanosecond-resolved Scanning Tunneling Microscopy: Facilitating the Investigation of Single Dopant Charge Dynamics
Published on: January 19, 2018
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Imaging Atomic Scale Dynamics on III-V Nanowire Surfaces During Electrical Operation.
J L Webb1, J Knutsson2, M Hjort2
1Division of Synchrotron Radiation Research, Lund University, Lund, Sweden. james.webb@sljus.lu.se.
Scientific Reports
|October 8, 2017
Summary
This study introduces a new platform for scanning tunneling microscopy (STM) to image atomic-scale surface changes in semiconductor devices during electrical operation. Unexpected surface smoothing and defect removal were observed on InAs nanowires under applied bias.
Area of Science:
- Materials Science
- Surface Science
- Nanotechnology
Background:
- Semiconductor device functionality is increasingly limited by atomic-scale surface and interface properties.
- These properties can dynamically change under applied voltages, impacting device performance and reliability.
- Current methods lack the ability to observe these changes in situ at atomic resolution across the entire device.
Purpose of the Study:
- To develop and demonstrate a novel device platform enabling simultaneous scanning tunneling microscopy (STM) imaging and full electrical operation.
- To investigate the atomic-scale surface behavior of semiconductor nanowires under applied bias.
- To explore the potential for new electronic functionalities arising from bias-induced surface restructuring.
Main Methods:
- Development of a versatile device platform compatible with standard fabrication and scanning instrumentation.
- Integration of STM imaging capabilities with full electrical operation across the device.
- Proof-of-principle measurements on Indium Arsenide (InAs) and Gallium Arsenide (GaAs) nanowire devices with applied biases up to 4V.
Main Results:
- Demonstration of STM imaging with atomic-scale resolution across the entire device during electrical operation.
- Observation of unexpected atomic defect removal and surface smoothing on InAs nanowires under applied bias.
- Contradiction of the anticipated increase in defects and electromigration-related failures.
Conclusions:
- The developed platform enables in-situ atomic-scale investigation of device surfaces during operation.
- Applied bias can induce beneficial surface restructuring, leading to defect removal and morphological smoothing.
- This approach opens avenues for fundamental studies of device reliability and the discovery of novel electronic functionalities.

