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Distributed backscattering in production O-band Si nanophotonic waveguides
Optics Express
|October 19, 2017
Summary
Distributed backscattering in silicon photonic waveguides was experimentally measured, revealing significant impact from sidewall defects. Findings provide crucial data for optimizing optical system performance using production foundry processes.
Area of Science:
- Photonics and Optical Engineering
- Materials Science
- Integrated Optics
Background:
- Backscattering in integrated photonic waveguides is a critical performance-limiting factor.
- Existing literature lacks extensive studies, especially on waveguides from production foundry processes.
Purpose of the Study:
- To experimentally measure and analyze distributed backscattering in production O-band silicon photonic waveguides.
- To identify the primary sources of backscattering in silicon and silicon nitride waveguides.
Main Methods:
- Experimental measurement of distributed backscattering.
- Analysis of backscattering trends across varying waveguide geometries and polarizations.
- Fabrication using production foundry processes.
Main Results:
- Measured backscattering ranged from -18 to -36 dB/mm in silicon waveguides.
- Sidewall stochastic defects were identified as the dominant source of backscattering in silicon.
- Both sidewall and cladding defects contribute to backscattering in silicon nitride waveguides.
Conclusions:
- Sidewall defects are the primary cause of backscattering in production silicon waveguides.
- Understanding these defects is crucial for improving optical system performance.
- Silicon nitride waveguides require consideration of both sidewall and cladding defects for accurate modeling.