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Observation of A Raman mode splitting in few layer black phosphorus encapsulated with hexagonal boron nitride
J M Urban1, M Baranowski, A Surrente
1Laboratoire National des Champs Magnétiques Intenses, UPR 3228, CNRS-UGA-UPS-INSA, Grenoble and Toulouse, France. paulina.plochocka@lncmi.cnrs.fr.
Nanoscale
|December 2, 2017
Summary
Encapsulating few-layer black phosphorus with hexagonal boron nitride (h-BN) sharpens Raman modes and reveals a new peak. This indicates strong interlayer interactions and improved surface quality in black phosphorus.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Black phosphorus is a promising 2D material with unique electronic and optical properties.
- Few-layer black phosphorus exhibits distinct Raman spectra sensitive to its environment.
- Hexagonal boron nitride (h-BN) is a van der Waals material used for encapsulating 2D materials.
Purpose of the Study:
- To investigate the effect of h-BN encapsulation on the Raman spectrum of few-layer black phosphorus.
- To understand how encapsulation influences phonon scattering and interlayer interactions.
- To identify new Raman modes and their origin in encapsulated black phosphorus.
Main Methods:
- Raman spectroscopy was performed on few-layer black phosphorus flakes encapsulated with h-BN.
- Analysis of Raman mode line widths to determine phonon scattering rates.
- Identification and characterization of new Raman peaks in the spectra.
Main Results:
- h-BN encapsulation significantly reduced the line width of black phosphorus Raman modes.
- A previously unobserved Raman peak was detected approximately 4 cm-1 above the A mode in thicker flakes.
- This new mode is attributed to strong interlayer interactions and surface atom vibrations.
Conclusions:
- h-BN encapsulation enhances the quality of few-layer black phosphorus by reducing phonon scattering.
- The newly observed Raman mode provides insights into interlayer coupling in black phosphorus.
- This mode can serve as an indicator of the surface quality and encapsulation effectiveness.
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