Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Age differences in susceptibility to stroke-related health misinformation on social media: the role of prior experience and corrective feedback.

Frontiers in public health·2026

Same author

A Hybrid Nonlinear Greater Cane Rat Algorithm with Teaching-Learning-Based Optimization for Global Optimization and Constrained Engineering Applications.

Biomimetics (Basel, Switzerland)·2026

Same author

Data Resource Profile: Cheeloo Lifespan Electronic-health reseArch Data-library (Cheeloo LEAD).

International journal of epidemiology·2026

Same author

Correlation-Driven Ultrafast Exciton Diffusion in Hubbard-Regime Moiré Superlattices.

Physical review letters·2026

Same author

Simultaneously Engineering the Amorphous Phase and Branch Morphology of High-Entropy Alloy Nanomaterials for Enhanced Ethylene Glycol Oxidation.

Advanced materials (Deerfield Beach, Fla.)·2026

Same author

Gender differences in the efficacy and safety of Maren Runchang Pills in treating constipation-predominant irritable bowel syndromes: A gender-stratified analysis.

Medicine·2026

Search research articles

Related Experiment Video

Updated: Feb 17, 2026

Quantifying the Relative Thickness of Conductive Ferromagnetic Materials Using Detector Coil-Based Pulsed Eddy Current Sensors

Quantifying the Relative Thickness of Conductive Ferromagnetic Materials Using Detector Coil-Based Pulsed Eddy Current Sensors

Published on: January 16, 2020

Signal processing and analysis for copper layer thickness measurement within a large variation range in the CMP

Hongkai Li¹, Qian Zhao¹, Xinchun Lu¹

¹State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing, China.

The Review of Scientific Instruments

|December 3, 2017

Summary

This study introduces an in situ eddy current system for measuring copper (Cu) layer thickness during chemical mechanical planarization (CMP). The system accurately tracks thickness variations, enabling precise endpoint detection in Cu CMP processes.

More Related Videos

High Resolution Physical Characterization of Single Metallic Nanoparticles

High Resolution Physical Characterization of Single Metallic Nanoparticles

Published on: June 28, 2019

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

Related Experiment Videos

Last Updated: Feb 17, 2026

Quantifying the Relative Thickness of Conductive Ferromagnetic Materials Using Detector Coil-Based Pulsed Eddy Current Sensors

Quantifying the Relative Thickness of Conductive Ferromagnetic Materials Using Detector Coil-Based Pulsed Eddy Current Sensors

Published on: January 16, 2020

High Resolution Physical Characterization of Single Metallic Nanoparticles

High Resolution Physical Characterization of Single Metallic Nanoparticles

Published on: June 28, 2019

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

Area of Science:

Materials Science
Semiconductor Manufacturing
Metrology

Background:

Accurate endpoint detection is crucial for copper (Cu) chemical mechanical planarization (CMP) to ensure wafer quality.
Eddy current technology offers a feasible method for in situ measurement of metal layer thickness.

Purpose of the Study:

To develop and apply an independently developed in situ measurement system using eddy current technology for the actual Cu CMP process.
To analyze the dynamic response characteristics of the output signal under different Cu layer thickness variations.

Main Methods:

An in situ measurement system based on eddy current technology was independently developed.
Experiments were conducted to analyze the dynamic response of the output signal.
A data processing algorithm was employed to extract voltage difference variations, representing Cu layer thickness.

Main Results:

The voltage difference of the output signal correlates negatively with Cu layer thickness in the conventional range, with increased sensitivity as thickness decreases.
A thickness threshold was identified, beyond which the correlation becomes negative.
The system's applicability across a wider Cu layer thickness range is possible with two calibration tables.

Conclusions:

The developed in situ eddy current system provides a viable method for monitoring Cu layer thickness during CMP.
The system demonstrates potential for precise endpoint detection by analyzing signal variations.
Calibration strategies can extend the operational range of the eddy current system for Cu CMP applications.